A Review of Hydrophilic Silicon Wafer Bonding

  • Masteika V
  • Kowal J
  • Braithwaite N
  • et al.
N/ACitations
Citations of this article
140Readers
Mendeley users who have this article in their library.

Abstract

Hydrophilically activated direct wafer bonding is a technique for gluelessly attaching oxide-coated wafers together. This ability is a vital step in the construction of many microelectronic and microelectromechanical (MEMS) devices. In particular this technique is widely used in the production of 3d interconnected devices due to the lack of interlayer. This review covers the key papers relating to the theory, techniques and quantification of hydrophilically activated silicon wafer bonding. This begins with a review of the history and development of the art. Bond strength characterization is then reviewed followed first by models of physical deformation and then by plasma and radical activation techniques. In the interests of clarity and succinctness this review is not an attempt to exhaustively catalog all direct bonding wafer literature. Excluded are hydrophobic and UHV bonding, and the many papers applying bonding techniques to differing combinations of wafer ma-terials. This paper concludes with a summery of the state of the art of direct wafer bonding and a summation of the current wafer-bonding model derived from the papers reviewed.

Cite

CITATION STYLE

APA

Masteika, V., Kowal, J., Braithwaite, N. St. J., & Rogers, T. (2014). A Review of Hydrophilic Silicon Wafer Bonding. ECS Journal of Solid State Science and Technology, 3(4), Q42–Q54. https://doi.org/10.1149/2.007403jss

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free