Copper based shape memory materials was interesting group of metal alloys that have a widespread potential in medical and industrial application due to their characteristics ,the possibility of exhibiting shape memory behavior and lower cost. In this research the alloy (Cu-(15-40) wt%Zn-6wt.%Al) has been prepared by powder metallurgy technique Zn element (15, 20, 25, 30, 35, 40 wt%Zn) and fixed percentage of Al content which is 6.wt%Al then aluminum replaced by (Si, Sn, Ni)element at fixed percentage of 6wt.%, in order to study the effect of these elements on SMA. After samples preparation examination were done by using XRD, SEM technique, DSC, Vickers hardness, Archimedes method to measure the porosity percentage and corrosion rate in different solutions (HCl, NaOH and SEAWATER).The XRD and microstructure results show that all samples with and without additives consist of two phases (β-phase) and (α-phase) at room temperature and the addition of alloying elements in these percentages does not have effect on present phases. the hardness increased with zinc content because the formation of intermetallic compound of CuZn that responsible to hardness while The addition of Si ,Sn and Ni leads to lower the hardness than aluminum. The bulk density increased with the alloys without addition alloying elements(Si, Ni and Sn) while apparent porosity decreased with it the reason for this phenomenon due to the characterization of alloying elements that addition to the alloy. From the results of corrosion test can be show the alloy with 35wt% Zn have the higher corrosion resistance in all media (HCl, NaOH and sea water) and the addition of alloying element lead to improve the corrosion resistance. Finally, it is observed that the Copper base shape memory alloys with these types of additives are suitable for use in different application.
CITATION STYLE
Al-Hassani, E. S., Ali, A. H., & Hatem, S. T. (2017). Investigation of Corrosion Behavior for Copper-Based Shape Memory Alloys in different Media. Engineering and Technology Journal, 35(6), 578–586. https://doi.org/10.30684/etj.35.6a.4
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