The high-temperature resistance properties of polysiloxane/Al coatings with low infrared emissivity

Abstract

High-temperature-resistant coatings with low infrared emissivity were prepared using polysiloxane resin and flake aluminum as the adhesive and pigment, respectively. The heat resistance mechanisms of the polysiloxane/Al coating were systematically investigated. The composition, surface morphology, infrared reflectance spectra, and thermal expansion dimension (ΔL) of the coatings were characterized by X-ray photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FE-SEM), Fourier transform infrared spectroscopy, and thermal mechanical analysis (TMA), respectively. The results show that thermal decomposition of the resin and mismatch of ΔL between the coating and the substrate facilitate the high temperature failure of the coating. A suitable amount of flake aluminum pigments could restrain the thermal decomposition of the resin and could increase the match degree of ΔL between the coating and substrate, leading to an enhanced thermal resistance of the coating. Our results find that a coating with a pigment to binder ratio (P/B ratio) of 1.0 could maintain integrity until 600 °C, and the infrared emissivity was as low as 0.27. Hence, a coating with high-temperature resistance and low emissivity was obtained. Such coatings can be used for infrared stealth technology or energy savings in high-temperature equipment.