Abstract
The limitation of the harmful lead-containing solders used in the electronics and other industry applications change lead with another metals. Interfacial reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and 450°C were studied. Three intermetallic compounds Ni3Sn4, T1, γ-Ni5Zn21 and liquid Sn were observed in the Ni/Sn-Zn diffusion couples. Scanning electron microscope was used for the investigation of the microstructure. The microhardness measurement of the intermetallic layers was also performed.
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Gandova, V. (2015). Interfacial reactions between solid Ni and liquid Sn-Zn alloys. Journal of Mining and Metallurgy, Section B: Metallurgy, 51(2), 179–184. https://doi.org/10.2298/JMMB141101021G
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