Abstract
Dry etching techniques (ion beam milling, rf-sputter etching, plasma etching and reactive sputter etching) as they are used in modern microlithography are reviewed. Special emphasis is given to parameters which are important in a high resolution pattern transfer process.
Cite
CITATION STYLE
APA
Lehmann, H. W. (1980). DRY ETCHING TECHNIQUES. Organic Geochemistry, 57–62. https://doi.org/10.2320/materia1962.28.55
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