Investigation of normal contact interaction between two bonded spherical particles with interface layer

Abstract

This paper presents investigation of normal con-tact interaction between two bonded spherical particles with interface layer. For the evaluation of the interface of the finite size, the new analytical model involving sequen-tially connected spring was suggested. The bond having different radii and material properties was examined analytically and by applying the finite element method (FEM). Result shows, that introducing of the stiffness of interface layer reduces the total normal stiffness being con-firmed by the FEM results.