Abstract
A review of the progress in DUV single layer resist technology during the last 10 years is presented and some of the more recent performance achievements are highlighted. Particular attention is directed to issues expected to become dominant on the verge from current design rules to the 70 nm node, and considered to be of general relevance for photoresist technology, such as pattern collapse, line edge roughness, and defect control. Other areas of discussion include plausible sub 100 nm extensions of specific techniques, such as thermal flow, or application of the RELACS process.
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Lee, D. K., & Pawlowski, G. (2002). The frog prince - A brief review of DUV resist technology. Journal of Photopolymer Science and Technology, 15(3), 427–434. https://doi.org/10.2494/photopolymer.15.427
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