A high-force, out-of-plane actuator with a MEMS-enabled microscissor motion amplifier

Abstract

The design, fabrication, and demonstration of a set of 2 mm2, high-force actuators that combine piezoelectric in-plane actuators with MEMS-enabled scissor mechanisms (motion amplifiers) to simultaneously produce high out-of-plane forces and large out-of-plane displacements are presented. The microscissor motion amplifier employs two layers of lithographically-patterned SU-8 microstructure laminated with a thin film of structural polyimide and adhesive to form hinges. Performance is optimized by varying layer thickness and adhesive types. Measured displacements of >3 μm and measured forces of >5 mN are observed, corresponding to a displacement per unit area of 1.6 μm/mm2 and a force per unit area of 2.6 mN/mm2. Cyanoacrylate adhesive provides superior performance to silicone adhesive, with larger force output. Thicker polyimide hinges provide smaller displacement but greater force than thinner polyimide hinges. These powerful, compact actuators have significant potential for high-force applications like tactile displays and micropumps.