Analysis of ball soldering parameters on the properties of a BGA packaged semiconductor

Abstract

Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical process, especially in assembling and interconnecting integrated circuits. The solder joint formed during the ball soldering process is intrinsically associated with the performance and the reliability of the electronic system. This study analyzed the influence of parameters or factors affecting the ball soldering process from the perspective of intermetallic compound formation and shear stress of the solder joint. The results indicate there is an interaction coupling between these two factors that cannot be seen when they are investigated individually, meaning that the individual effect of each factor differs from that of the combinations of factors. The results showed that the factor that most influenced shear stress and thickness of the intermetallic compound was peak temperature during ball soldering.