Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

Abstract

A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO2). Compared to the epoxy (EP) composites with randomly dispersed BN and SiO2, the EP/SiO2@BN showed a great enhancement in thermal conduction. The thermal conductivity of EP/SiO2@BN reached to 0.86 W m-1 K-1 with 60 wt% content of hybrid filler, which was 91% higher than that of EP/SiO2 samples and was around 12% higher than that of epoxy composites with unmodified BN and SiO2. In addition, the EP/SiO2@BN exhibited lower thermal interface resistance in comparison with EP/SiO2&BN composites according to the effective medium theory (EMT). The encapsulation of BN on the surface of SiO2 greatly enhanced the thermal transfer efficiency of the epoxy matrix and showed great potential in the epoxy packaging practical application.