Abstract
A paper deals with thermal analysis of ethylene-vinyl acetate encapsulant material used in photovoltaic modules. Properties were analysed in the temperature range from -70 °C to +130 °C. Differential scanning calorimetry and dynamic mechanical analysis were applied. It has been proven that the encapsulant passes through both a glass transition and a melting phase in the range of operation temperatures of the photovoltaic modules. Obtained results show that the encapsulant materials play essential role from the operation point of view and its properties can by no means be underestimated.
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CITATION STYLE
Polansky, R., Prosr, P., & Pinkerova, M. (2011). Investigation of encapsulant material used in photovoltaic modules by thermal analyses. In Annals of DAAAM and Proceedings of the International DAAAM Symposium (pp. 409–410). Danube Adria Association for Automation and Manufacturing, DAAAM. https://doi.org/10.2507/22nd.daaam.proceedings.203
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