High-Performance Indium Oxide Thin-Film Transistors with Aluminum Oxide Passivation

Abstract

In this letter, high-performance thin-film transistors (TFTs), with indium oxide (In2O3) as front channel layer, high permittivity ZrO2 as dielectric layer, and aluminum oxide (Al2O3) as passivation layers were integrated by a fully solution process. It is found that the incorporation of Al2O3 passivation layer gives rise to a sharp decrease in the off current (Ioff) and a corresponding increase in the on/off current ratio ( \text{I} {\text {on}} /Ioff) of the TFTs, compared to that without Al2O3 passivation. Furthermore, the thickness effect of the passivation layer on the performance of In2O3 /ZrO2 TFTs has been investigated systematically. The In2O3 /ZrO2 TFTs with optimized Al2O3 passivation layers can be operated at 3 V with high performance, including a high field-effect mobility of 21.22 cm2 /V s, a large \text{I} {\text {on}} /I off of 107 and a negligible hysteresis (0V). This work demonstrates an effective strategy for the construction of high performance TFTs by incorporating the passivation layer.