Room-Temperature Indentation Creep and the Mechanical Properties of Rapidly Solidified Sn-Sb-Pb-Cu Alloys

Abstract

In this paper, we study the room-temperature indentation creep and the mechanical properties of Sn-Sb-Pb-Cu alloys. Rapid solidification from melt using the melt-spinning technique is applied to prepare all the alloys. The experimental results show that the magnitude of the creep displacement increases with the increase in both time and applied load, and the stress exponent increases with the increase in the copper content in the alloys which happens primarily due to the existence of the intermetallic compounds SbSn and Cu6Sn5. The calculated values of the stress exponent are in the range of 2.82 to 5.16, which are in good agreement with the values reported for the Sn-Sb-Pb-Cu alloys. We have also studied and analyzed the structure, elastic modulus, and internal friction of the Sn-Sb-Pb-Cu alloys.