Novel fabrication method of microchannel plates

Abstract

We have developed a novel microchannel plate (MCP) by introducing new materials and process technologies. The key features of our MCP are summarized as follows: (i) bulk alumina as a substrate, (ii) the channel location defined by a programmed-hole puncher, (iii) thin film deposition by electroless plating and/or sol-gel process, and (iv) an easy fabrication process suitable for mass production and a large-sized MCP. The characteristics of the resulting MCP have been evaluated with a high input current source such as a continuous electron beam from an electron gun and Spindt-type field emitters to obtain information on electron multiplication. In the case of a 0.28 μA incident beam, the output current enhances ∼170 times, which is equal to 1% of the total bias current of the MCP at a given bias voltage of 2600 V. When we insert a MCP between the cathode and the anode of a field emission display panel, the brightness of luminescent light increases 3-4 times by multiplying the emitted electrons through pore arrays of a MCP. © 2000 American Institute of Physics.