High-Speed-Operation of All-Silicon Lumped-Electrode Modulator Integrated with Passive Equalizer

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Abstract

Silicon photonics technology is a promising candidate for small form factor transceivers that can be used in data-center applications. This technology has a small footprint, a low fabrication cost, and good temperature immunity. However, its main challenge is due to the high baud rate operation for optical modulators with a low power consumption. This paper investigates an all-Silicon Mach-Zehnder modulator based on the lumped-electrode optical phase shifters. These phase shifters are driven by a complementary metal oxide semiconductor (CMOS) inverter driver to achieve a low power optical transmitter. This architecture improves the power efficiency because an electrical digital-To-Analog converter (DAC) and a linear driver are not required. In addition, the current only flows at the time of data transition. For this purpose, we use a PIN-diode phase shifter. These phase shifters have a large capacitance so the driving voltage can be reduced while maintaining an optical phase shift. On the other hand, this study integrates a passive resistance-capacitance (RC) equalizer with a PIN-phase shifter to expand the electro-optic (EO) bandwidth of a modulator. Therefore, the modulation efficiency and the EO bandwidth can be optimized by designing the capacitor of the RC equalizer. This paper reviews the recent progress for the high-speed operation of an all-Si PIN-RC modulator. This study introduces a metal-insulator-metal (MIM) structure for a capacitor with a passive RC equalizer to obtain a wider EO bandwidth. As a result, this investigation achieves an EO bandwidth of 35.7 37 GHz and a 70 Gbaud NRZ operation is confirmed.

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Sobu, Y., Tanaka, S., & Tanaka, Y. (2020). High-Speed-Operation of All-Silicon Lumped-Electrode Modulator Integrated with Passive Equalizer. In IEICE Transactions on Electronics (Vol. E103.C, pp. 619–626). Institute of Electronics, Information and Communication, Engineers, IEICE. https://doi.org/10.1587/transele.2019OCP0006

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