Abstract
The status of understanding of the behavior of hydrogen in GaN and related materials is reviewed. In particular, we discuss the amount of residual hydrogen in MOCVD-grown device structures such as heterojunction bipolar transistors, thyristors and p-i-n diodes intended for high power, high temperature applications. In these structures, the residual hydrogen originating from the growth precursors decorates Mg-doped layers and AlGaN/GaN interfaces. There is a significant difference in the diffusion characteristics and thermal stability of implanted hydrogen between n- and p-GaN, due to the stronger affinity of hydrogen to pair with acceptor dopants and possibly to the difference in H 2 formation probability.
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CITATION STYLE
Pearton, S. J., Cho, H., Ren, F., Chyi, J. I., Han, J., & Wilson, R. G. (2000). Properties and effects of hydrogen in GaN. In MRS Internet Journal of Nitride Semiconductor Research (Vol. 5). Materials Research Society. https://doi.org/10.1557/s1092578300004749
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