Thermal expansivity of polymer nanocomposites and applications

Abstract

Nowadays, the quest for fabricating polymeric nanocomposites with enhanced thermomechanical properties has tremendously escalated as a result of their multifunctional applications in advanced engineering areas sensitive to thermal expansion. Thermal expansion and coefficient of thermal expansion (CTE) of polymers as well as polymeric nanocomposites are critical properties due to the relatively elevated CTE of polymeric matrices in comparison with other materials. Polymer matrices are embedded with low-CTE or negative-CTE fillers in order to minimize the CTE mismatch which occurs in components where polymeric matrices are used in synergy with other materials. This facilitates their usage as system adhesives, electronical flip-clip underfills, metallic component replacement, coatings, electronic packaging, and so on. Thermal Mechanical Analysis (TMA) is a technique used in measuring thermal expansivity and contractivity of polymeric nanocomposites. Therefore, this paper presents in depth insight into thermal expansivity and coefficient of thermal expansivity of polymeric nanocomposites (PNC) and applications.