Self-compliance and high performance Pt/Hfox/Ti RRAM achieved through annealing

Abstract

A self-compliance resistive random access memory (RRAM) achieved through thermal annealing of a Pt/HfOx/Ti structure. The electrical characteristic measurements show that the forming voltage of the device annealing at 500◦C decreased, and the switching ratio and uniformity improved. Tests on the device’s cycling endurance and data retention characteristics found that the device had over 1000 erase/write endurance and over 105 s of lifetime (85◦C). The switching mechanisms of the devices before and after annealing were also discussed.