The effects of chemical components and particle size on the mechanical properties of binderless boards made from oak (Quercus spp.) logs degraded by shiitake fungi (Lentinula edodes)

Abstract

Binderless boards are composite boards that rely on self-bonding mechanisms for inter-fibre bonding. Quercus acutissima and Quercus serrata logs degraded by Lentinula edodes (shiitake fungi) were used in this study to investigate whether physical and chemical changes induced by shiitake fungi can enhance board mechanical properties. Binderless boards were manufactured with 0.8 g/cm3 target density, 220 °C pressing temperature, 5 MPa pressure, and pressing duration of 10 min. Boards made from logs degraded for ≥ 26 months were stronger than control boards and met modulus of rupture (MOR) and internal bonding (IB) requirements for fibreboards. Chemical composition and particle size distribution of the wood powder used to make the boards were determined to elucidate the drivers of board mechanical properties. The proportion of small particles (< 150 µm) showed a strong positive correlation with MOR for both species and hot water extractives showed a strong positive correlation with IB for Q. acutissima boards. Introduction of shiitake fungi pre-treatment to the production process may enhance the mechanical strength of binderless boards.