Fabrication of Ti/Ti5Si3 functionally graded material by eutectic bonding method

Abstract

Ti/Ti5Si3 functionally graded material was fabricated by a eutectic bonding method. A metal Ti and an intermetallic compound Ti5Si3 were bonded by utilizing a eutectic reaction, where Ti5Si3 was chosen because of its high heat resistance and high oxidation one. In the case of bonding the stoichiometric Ti5Si3 with the pure Ti, cracks were formed within the Ti5Si3 part. Since the cracking was suspected to occur due to the low ductility of the stoichiometric Ti5Si3, a Ti-rich Ti5Si3 which is ductiler than the stoichiometric Ti5Si3 was applied in place of the stoichiometric Ti5Si3. As a result, a sound FGM without any detectable defects was realized.