Development of printed circuit board multi-layered type ECF-pump and its application to liquid cooling system

Abstract

By developing various electronic equipments with high performance, the dissipated power of electric chips used in those equipments has been increased. Therefore, it has been important to cool those electronic chips, and a liquid-cooling system has been employed for some electronic equipments. An Electro-Conjugate Fluid (ECF), which is one of functional fluids, has a remarkable property that a jet flow is generated between two electrodes when a high voltage is applied to the electrodes. By the use of this strong jet flow, a pump with simple structure, no noise and no vibration can be developed and a new liquid cooling system by ECF seems to be realized. In this study, to realize the liquid cooling system by ECF, an ECF-pump is proposed, in which four printed circuit boards are layered to make the pump size compact. The proposed pump is fabricated, and experiments are performed to investigate the basic characteristics of the pump. Furthermore, in the liquid cooling system with the proposed pump, experiments to cools a heat source are performed to investigate the possibility of achievement of the liquid cooling system by ECF.