Progress and Application of Key Technologies on the Electronic Packaging Equipment Development

Abstract

As the rapid development of electronic and communication industry, high performance electronic packaging equipment has been the great demand for most semiconductor manufacturing enterprises. The research and development of precision electronic packaging equipment needs obtaining the breakthrough on the design theory and methods. Considering the restrict requests on the motion of large stroke, high speed, high acceleration with high positioning accuracy, the innovation design and theory on the kennel technologies are intensively studied, and a decoupled parallel XY motion stage with high speed is proposed. Based on the workspace analysis and riemannian metric evaluation, the stage parameter optimization is performed. Due to the motion with a high speed and high acceleration, it is difficult to reduce rapidly the inertial energy and the vibration to the high-speed low-load mechanism. To tackle this problem, a novel structural optimization and motion planning method is proposed for precision positioning of high speed mechanism based on optimal spatial and temporal distribution of inertial energy. Considering the demands of high responding speed and positioning accuracy of the control system in packaging equipment, a control system scheme with a multi-kennel and multi-task controller and an integrated driving-controlling system are adopted, which can improve the performance of real time, reliability and coordination. In order to realize a close-loop position control for the high-speed movement, an novel linear optical encoder with absolute imaging position system is invented, which can provide the position information and feed back to the control system for the precision positioning. The capillary motion path of the bonding process and the impact force to the bonding interface are also studied. Based on these key technologies, the wire bonding machines with high performance are developed with success.