Abstract
Monolithically integrated lasers on silicon photonics enable scalable, foundry-compatible production for data communications applications. However, material mismatches in heteroepitaxial systems and high coupling losses pose challenges for III-V integration on silicon. We combine three techniques: recessed silicon pockets for III-V growth, two-step heteroepitaxy using both MOCVD and MBE, and a polymer facet gap-fill approach to develop O-band InAs quantum dot lasers monolithically integrated on silicon photonics chiplets. Lasers coupled to silicon ring resonators and silicon nitride distributed Bragg reflectors (DBR) demonstrate single-mode lasing with side-mode suppression ratio up to 32 dB. Devices lase at temperatures up to 105 °C with an extrapolated operational lifetime of 6.2 years at 35 °C.
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Koscica, R., Skipper, A., Shi, B., Feng, K., Leake, G., Zylstra, M., … Bowers, J. E. (2025). Quantum Dot DBR Lasers Monolithically Integrated on Silicon Photonics by In-Pocket Heteroepitaxy. Journal of Lightwave Technology, 43(12), 5773–5781. https://doi.org/10.1109/JLT.2025.3555555
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