Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics

Abstract

A novel method relying on strain engineering to realize arrays of on-chip-integrated giant magneto-impedance (GMI) sensors equipped with pick-up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography.