Thermal Conductivity of Nanoparticles Filled Polymers

Abstract

Thermal conductivity of polymers is an important thermal property for both polymer applications and processing. Polymers typically have intrinsic thermal conductivity much lower than those for metals or ceramic materials, and therefore are good thermal insulators. Further enhancement of this thermal insulating quality can be achieved by foaming polymers. In other applications which require higher thermal conductivity, such as in electronic packaging and encapsulations, satellite devices, and in areas where good heat dissipation, low thermal expansion and light weight are needed, polymers reinforced with fillers, organic or inorganic, are becoming more and more common in producing advanced polymer composites for these applications (Hodgin & Estes, 1999; Tavman, 2004; Lee & Eun, 2004; Liu & Mather, 2004; Ishida & Heights, 1999; Frank & Phillip, 2002; Hermansen, 2001; Ishida, 2000). Most polymeric materials are processed and fabricated at elevated temperatures, often above their melting temperatures. This process may be long and expensive because of the low thermal conductivity of polymers. Subsequently, the cooling process or annealing may also be controlled by heat transport properties of polymers, which eventually affect the physical properties of the materials. One example is crystalline polymers, for which the structural and morphological features may be significantly changed with the speed of cooling. Careful consideration in designing polymer processing is vital to achieve desired properties.