Analysis of a passive heat sink for temperature stabilization of high-power LED bulbs

Abstract

In this paper we present a numerical analysis and experimental measurements of the temperature stabilization of high-power LED chips that we have obtained by employing an aluminum passive heat sink, designed to be used in a compact light bulb configuration. We demonstrate that our system keeps the temperature of the LED chip well-below 70° C yielding long-term operation of the device. Our simulations have been performed for a low-cost device ready to install in public streetlights. The experimental measurements performed in different configurations show a nice agreement with the numerical calculations.