A New Composition of High Heat General Purpose Polystyrene (High Heat GPPS) Resin

Abstract

A new composition of high heat general-purpose polystyrene (High heat GPPS) resin synthesis is discussed. The new composition of resin involves addition of cross-linker/comonomer in very low concentration during synthesis process. Commercially available vinyl cross-linkers like divinylbenzene (DVB), Ethylene dimethacrylate (EDM), Tricycle (5.2.1.02,6) decanedimethanol diacrylate (TDDDA), Dicyclopentadiene (DCPD) and vinyl comonomer like maleic anhydride, α-methylstyrene have been evaluated via bulk polymerization method. DVB showed enhancement in the heat distortion temperature (HDT), vicat softening temperature (VST) & melt flow index (MFI) compared to the benchmark grade of GPPS, whereas other mechanical and impact properties remained same or better than benchmark grade under identical methods of measurement.