Development Status and Perspective Trend of Ultrathin Vapor Chamber

Abstract

With the emergence and rapid development of the fifth-generation mobile communication technology (5G technology), electronics, especially smart phones and tablet PC, are developing increasingly towards high performance, high integration and miniaturization. This will result in ultrahigh heat flux and operating temperature in narrow space, further lead to serious thermal problems. Ultrathin vapor chamber (UTVC) with the advantages of outstanding thermal conductivity, large heat transfer area, good temperature uniformity and high reliability, is the primary method to solve this problem. To meet the heat dissipation requirement of modern miniaturized electronics under 5G era, the further ultrathin development of UTVCs have been the focus in current industry and academia. Based on this, the heat transfer mechanism of UTVCs is firstly summarized. The research status of UTVC structures, including gas-liquid channel arrangement and wick, is reviewed. Then, the packaging and manufacturing methods of UTVCs are introduced. Additionally, the problems existed in the extremely ultrathin development in UTVCs are pointed out. Finally, the research trend and development of UTVCs in heat dissipation fields of high integration and ultrathin electronics are prospected.