Development of a next-generation temporary fixing agent for electronic materials

Abstract

We have developed a next-generation temporary fixing agent for electronic materials. This fixing agent allows for film peel-off via immersion in hot water while retaining strong adhesiveness, which can resist various forms of processing. Although thermoplastic adhesives (known as waxes) have been previously used as temporary fixing agents, problems related to their safety and workability were observed because they melt at high temperatures during the adhesion process. In addition, environmental issues were encountered due to the use of organic solvents in the cleaning process that was performed after peel-off. Conversely, our temporary fixing agent is expected to compensate for such limitations because it possesses advantageous characteristics, such as curing capabilities over short durations at room temperature using redox polymerization or photopolymerization, peel-off via immersion in hot water, and a film-type peel-off. Such fixing agents are becoming the de facto standard for use in the processing of capacitive touch sensors in glass covers, for example, in smartphones and tablet PCs.