Thermal conductivity analysis of a new sub-micron sized polystyrene foam

Abstract

New polystyrene (PS) foams with submicron pore sizes and open pore structure are introduced as potential cores for vacuum insulation panels (VIPs). Measurements of the thermal conductivity λ of the air-filled and evacuated PS foams, the influence of temperature T, opacifiers as well as gas pressure p on the thermal conductivity λ are presented. First results of the foam microstructures, as visualized by electron microscopy, confirm that pore sizes below 1 µm can be achieved. Thermal conductivity values of advanced samples in vacuum of about 7 mW/(m·K) were measured.