Resistivity reduction and adhesion increase induced by surface and interface segregation of Ti atoms in Cu(Ti) alloy films on glass substrates

Abstract

Low-resistivity and excellent-adhesion Cu(Ti) alloy films were prepared on glass substrates. Cu(0.3∼4 at%Ti) alloy films were deposited on the substrates, and subsequently annealed in vacuum at 400°C for 3 h. Resistivity of the annealed Cu(Ti) alloy films was significantly reduced to about 2.8 μ.ficm. Tensile Ωstrength of the Cu(Ti)/glass interface increased to about 60 MPa after annealing. The low resistivity and excellent adhesion resulted from Ti segregation at the film surface and the Cu(Ti)/glass interface. The segregated Ti atoms reacted with atmospheric oxygen at the surface and with oxygen in glass and/or from atmosphere at the interface, and formed a TiO2 layer at the surface and a TiO2 layer with a small amount Of Ti2O3 and TiO at the interface. The layers were non-crystalline. Columnar grains in the alloy films were seen to enhance Ti segregation and subsequent Cu grain growth. The Cu grain growth also contributed to low resistivity of Cu(Ti) alloy films. © 2010 The Japan Institute of Metals.