Abstract
© The Author(s) 2017. 1,2-4 Triazole (TAZ), N-lauroylsarcosine sodium salt (NLS) and potassium oleate (PO) were tested as passivating additives to previously developed H 2 O 2 and citric acid-based silica dispersions for the polishing of chemical vapor deposited Co films for interconnect applications. In comparison to TAZ and NLS, Co corrosion currents are ~1 to 2 order of magnitude lower (~1–3 μA cm −2 ) at pH 7 with PO and post-polish surface quality was much better. The galvanic corrosion currents between Co-Ti and Ti-TiN couples with PO were also very low (∼0.1 μA cm −2 ), making the previously developed silica and citric acid-based dispersion, now containing PO, suitable for both bulk removal of Co (step I) and for planarizing Co/Ti/TiN structures (step II) with excellent selectivity while stopping on low-k dielectric. Langmuir adsorption isotherm model analysis showed that the standard free energies of adsorption values were ∼−40 kJ/mol for PO suggesting chemisorption. Fourier transform infra-red (FTIR) and attenuated FTIR spectroscopy data show bridging coordination between the carboxylate ligand of PO and the Co surface.
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CITATION STYLE
Popuri, R., Amanapu, H., Ranaweera, C. K., Baradanahalli, N. K., & Babu, S. V. (2017). Potassium Oleate as a Dissolution and Corrosion Inhibitor during Chemical Mechanical Planarization of Chemical Vapor Deposited Co Films for Interconnect Applications. ECS Journal of Solid State Science and Technology, 6(12), P845–P852. https://doi.org/10.1149/2.0251712jss
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