Evaluation of the Mechanical and Electrical Properties of Multistage Drawn Copper-Clad Aluminum Wire After Annealing Process

Abstract

This study evaluates the mechanical and electrical properties of copper-clad aluminum (CCA) wire prepared with a total cross-section reduction of 89% through a multistage cold drawing process and subjected to annealing at various temperatures. In addition to the CCA wire, individual samples of oxygen-free copper and aluminum, drawn with a cross-sectional reduction of 50%, were annealed under the same temperature conditions to enable a comparative analysis. Tensile tests for strength and elongation measurements were conducted, while electrical conductivity was assessed through resistivity tests. SEM and EDS analyses were performed to examine the diffusion thickness and the composition of intermetallic compounds generated at the Al/Cu interface of CCA wire. The tensile strength of the CCA wire decreased and its elongation increased up to 250 °C, after which were maintained. As the annealing temperature increased, intermetallic compound layers of Al2Cu, AlCu, and Al4Cu9 were formed at the Al/Cu interface of the CCA wire, and their thickness increased. Electrical conductivity reaches a maximum at 200 °C and then continuously decreases, showing a negative linear correlation with an increase in the diffusion layer thickness of intermetallic compounds. The study confirmed that cold-drawn CCA wire achieves stable mechanical properties and maximum electrical conductivity at the optimal annealing temperature.