Ternary Cu2SnS3 Thin Films Deposited by Fully Controlled System of Spray Pyrolysis

Abstract

A fully computerized system of spray pyrolysis was employed for fabricating copper tin sulphite ternary thin film onto glass substrates. During deposition process, the glass substrate was maintained at 310 ± 10 °C. After dissolving the raw chemicals, a mixture of their aqueous solutions was used for spraying process. The optimum solution mixture at the volumetric ratio [S/(Cu+Sn)=1] at 1.5 of pH. XRD investigation was approved a monoclinic phase of CTS. A number of different platform speed was tested in the deposition process. XRD diffraction peaks were described at 2θ = 28.39°, 33.02°, 47.34°, and 56.39° corresponding to the and , respectively. These are crystal planes of monoclinic copper tin sulphide. The FTIR study certified a number of the chemical bond of Cu-, Sn-and S-. The grain size was observed in the range of nano using Scherrer formula. Studying surface morphology of CTS films reveals a uniform coating on the substrates which approved by SEM investigations.