Abstract
A long-standing goal of GaN device research has been the development of a reliable, well-controlled process for p-GaN formation by ion implantation. Results to date have indicated an activation of 1% or less using high-temperature rapid thermal annealing (RTA) techniques and coimplantation. Although Mg is a relatively deep acceptor, this is still much less than the theoretically achievable value (8.2% based on the 160 meV acceptor level). A multicycle RTA process is presented that is capable of achieving up to 8% activation of the Mg-implanted GaN. This approaches the theoretical value, and represents a significant step in GaN device research. © 2014 The Institution of Engineering and Technology.
Cite
CITATION STYLE
Anderson, T. J., Feigelson, B. N., Kub, F. J., Tadjer, M. J., Hobart, K. D., Mastro, M. A., … Eddy, C. R. (2014). Activation of Mg implanted in GaN by multicycle rapid thermal annealing. Electronics Letters, 50(3), 197–198. https://doi.org/10.1049/el.2013.3214
Register to see more suggestions
Mendeley helps you to discover research relevant for your work.