Abstract
Metallization of Schottky surface gates by sputtering Au on strained SiSiGe heterojunctions enables the depletion of the two dimensional electron gas at a relatively small voltage while maintaining an extremely low level of leakage current. A fabrication process has been developed to enable the formation of submicron Au electrodes sputtered onto SiSiGe without the need of a wetting layer. © 2007 American Institute of Physics.
Cite
CITATION STYLE
Scott, G. D., Xiao, M., Jiang, H. W., Croke, E. T., & Yablonovitch, E. (2007). Sputtered gold as an effective Schottky gate for strained Si/SiGe nanostructures. Applied Physics Letters, 90(3). https://doi.org/10.1063/1.2430935
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