Thermal conductivity for polymer composite materials: Recent advances in polyimide materials

Abstract

Polymer materials have received much attention from a wide range of Industrial Interests. Functional fillers are often Introduced to polymers to add new functions that the pristine polymer materials show Inferior values. As for thermal conductivity (TC), thermal conductive fillers such as ceramics, functional nanocarbons, and metals are often used. Among the polymers used In Industrial fields, polyimide (PI) has excellent thermal stability and solvent resistance. However, the TC of PI Is low as Is often the case In other commonly used polymers. In the present paper, Pl-based composite materials were reviewed from the viewpoint of TC. Hexagonal boron nitride, aluminum nitride, graphene, graphene derivatives (graphene oxide, reduced graphene oxide) and carbon nanotubes were the focus as representative thermal conductive fillers.