Abstract
AlN thin films were deposited at various substrate temperatures via Plasma Source Molecular Beam Epitaxy. The films were grown on 6H-SiC (0001) substrates. Reflection High Energy Electron Diffraction and Atomic Force Microscopy showed a dramatic change in the surface morphology of the film grown at 640°C. This is attributed to a change in the growth mechanism from pseudomorphic at lower temperatures to three-dimensional at higher than 640°C temperatures. Photoreflectance measurements showed an absorption shift toward 200 nm as the deposition temperature increases which is attributed to the change in the growth mechanism at higher temperatures. X-Ray Diffraction was unable to conclusively determine the AlN (0002) peak due to a significant diffuse intensity from the SiC (0002) peak. A MIS structure was created by depositing Pt contacts on the film grown at 500°C. I-V measurements showed that the Pt/AlN contact is Schottky.
Cite
CITATION STYLE
Thompson, M. P., Drews, A. R., Huang, C., & Auner, G. W. (1999). Temperature effect on the quality of AlN thin films. In MRS Internet Journal of Nitride Semiconductor Research (Vol. 4). https://doi.org/10.1557/s1092578300002362
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