Journal ArticleOPEN ACCESS

Flip-Chip Bonding on PWB.

  • RAI A
  • DOTTA Y
  • NUKII T
  • et al.
Circuit Technology (1993) 8(2) 136-143
DOI: 10.5104/jiep1986.8.136
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RAI, A., DOTTA, Y., NUKII, T., & OHNISHI, T. (1993). Flip-Chip Bonding on PWB. Circuit Technology, 8(2), 136–143. https://doi.org/10.5104/jiep1986.8.136

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