Vacuum-assisted aerosol deposition of a low-dielectric-constant periodic mesoporous organosilica film

Abstract

Low-dielectric-constant periodic mesoporous organosilica thin films are fabricated by vacuum-assisted aerosol deposition, a vapor-phase delivery technique favored by the semiconductor industry. The mesostructured films possess a combination of dielectric and mechanical properties that make them an ideal candidate for insulating materials on semiconductor chips (see image). © 2010 WILEY-VCH Verlag GmbH & Co. KGaA.