Thermal conductivity of crack-containing media: A numerical study

Abstract

The present study aims to evaluate the effective thermal conduction behavior of crack-containing media through micromechanical modeling. Numerical analyses were performed using the finite element method, first using periodic arrays of elliptical pores and then reducing the elliptical minor axis to reach the crack limit. This parametric approach was seen to be able to capture the effect of discontinuity across the crack face in a straightforward manner. The overall thermal conductivity of the model structures, encompassing a range of crack densities and spatial distributions, was investigated. It was found that, for cracks with mixed orientations, the effective thermal conductivity is insensitive to the actual crack alignment and can be uniquely represented by the crack density. The mixed-orientation periodic crack configurations are also representative of random sizes, orientations, and spatial distributions of cracks, thus exhibiting a high degree of generality. The modeling analyses can also be used to determine simple empirical expressions for two- and three-dimensional media containing random cracks.