One-step growth of wafer-scale monolayer tungsten disulfide via hydrogen sulfide assisted chemical vapor deposition

Abstract

Wafer-scale monolayer WS2 has been widely investigated. Here, we report a repeatable and low-cost one-step chemical vapor deposition method for the direct growth of a 4-in. monolayer WS2 film on a thermal oxide silicon wafer by using WO3 and H2S gas as precursors. H2S gas exhibits a high vulcanization ability and can effectively reduce the growth temperature of WS2 to 825 °C. The growth process follows a self-limiting growth to form a monolayer polycrystalline film, which is merged via many stable small-angle grain boundaries. The wafer-scale monolayer WS2 film shows uniform and high-quality electrical properties. This method helps promote the future production and application of wafer-scale monolayer sulfide.