Subsurface damage in grinding silicon ceramics

Abstract

Subsurface damage evaluation is performed using a combination of scanning electron microscopy and damage inspection techniques on silicon nitride and silicon carbide ground by single point diamond tools and diamond wheels. Two forms of surface damage are indentified, material pulverization in the superficial layer forming o powder regime and void geration in the subsurface layer. Material pulverization is observed that forms a powder-regime layer on a ground work-piece surface, which is the dominant materialremoval mechanism up to certain depth of cut. Underneath the powder-regime layer, damage is identified in the ground workpiece, and is assessed and characterized with respect to type of workpiece material and grit size of grinding wheels.,.