A Contactless Method for the Directed Formation of Submicrometer Copper Wires

Abstract

We report the growth of the submicrometer wires onto copper particles a few micrometers in diameter without the use of photolithography, templates, or physical contact to an external circuit. The wires were grown by a spatially coupled electrodissolution and electrode-position mechanism directed by the action of an electric field. Scanning electron micrographs of the wires indicate that they are composed of ropelike deposits as small as 0.3 mu m in diameter. The ability to form such miniature structures at a predictable location on the particle surface relies on the toposelective (site-selective) interaction of the electric field with the particles. These results may point to a novel method for constructing submicrometer electronic devices.