Abstract
With the exponential growth of the semiconductor industry, radiation-hardness has become an indispensable property of memory devices. However, implementation of radiation-hardened semiconductor memory devices inevitably requires various radiation-hardening technologies from the layout level to the system level, and such technologies incur a significant energy overhead. Thus, there is a growing demand for emerging memory devices that are energy-efficient and intrinsically radiation-hard. Here, we report a nanoelectromechanical non-volatile memory (NEM-NVM) with an ultra-low energy consumption and radiation-hardness. To achieve an ultra-low operating energy of less than 10 fJ bit − 1, we introduce an out-of-plane electrode configuration and electrothermal erase operation. These approaches enable the NEM-NVM to be programmed with an ultra-low energy of 2.83 fJ bit − 1. Furthermore, due to its mechanically operating mechanisms and radiation-robust structural material, the NEM-NVM retains its superb characteristics without radiation-induced degradation such as increased leakage current, threshold voltage shift, and unintended bit-flip even after 1 Mrad irradiation.
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CITATION STYLE
Lee, Y. B., Kang, M. H., Choi, P. K., Kim, S. H., Kim, T. S., Lee, S. Y., & Yoon, J. B. (2023). Sub-10 fJ/bit radiation-hard nanoelectromechanical non-volatile memory. Nature Communications, 14(1). https://doi.org/10.1038/s41467-023-36076-0
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