Bonding Wire Interconnects between MMIC for 5-GHz Intra/Inter-Chip Communications

Abstract

The modeling of the bonding-wire connectivity is the focus of this paper. The goal was to transfer as much power as possible while minimizing return loss (Insertion loss). We utilized a program called High Frequency Structure Simulator to get the job done (HFSS®). Wires of various geometries are evaluated to acquire good results. In addition to the squares, there were also circles and half-hexagons. Equivalent series and shunt capacitances create a low-pass network to describe this characteristic. Using this approach, the bonding-wire discontinuity can be more easily matched. Few experiments were also carried out, with positive outcomes.