Adhesion promoter for a multi-dielectric-layer on a digital microfluidic chip

Abstract

A silane-based adhesion promoter suitable for a multi-dielectric-layer coating on a digital microfluidic chip is reported. It measures >100× improvement in chip lifetime via transforming the bonding of the dielectric layers (Ta 2 O 5 and Parylene C) from nonspecific to chemical. The refined chip-fabrication protocol also allows low EWOD actuation voltages down to 5 V.