Silicon metalens fabrication from electron beam to uv‐nanoimprint lithography

Abstract

This study presents the design and manufacture of metasurface lenses optimized for focusing light with 1.55 μm wavelength. The lenses are fabricated on silicon substrates using electron beam lithography, ultraviolet‐nanoimprint lithography and cryogenic deep reactive‐ion etching techniques. The designed metasurface makes use of the geometrical phase principle and consists of rectangular pillars with target dimensions of height h = 1200 nm, width w = 230 nm, length l = 354 nm and periodicity p = 835 nm. The simulated efficiency of the lens is 60%, while the master lenses obtained by using electron beam lithography are found to have an efficiency of 45%. The lenses subsequently fabricated via nanoimprint are characterized by an efficiency of 6%; the low efficiency is mainly attributed to the rounding of the rectangular nanostructures during the pattern transfer processes from the resist to silicon due to the presence of a thicker residual layer.