Photo-acoustic measurement and evaluation of thermal resistance of solid contact face

  • KAGATA K
  • YAMADA T
  • YOSHIDA A
N/ACitations
Citations of this article
10Readers
Mendeley users who have this article in their library.

Abstract

In thermal design of mechanical and electronic equipment with increasing complexity, it is important to estimate thermal contact resistance correctly. In the present study, photo-acoustic method (PAM) is applied, with the aid of theoretical considerations, to the measurements of thermal contact resistance between solids. PAM is one of the non-contact and non-destructive methods for detecting thermal properties of various materials. This method is used to extract thermal contact resistance from the data of maximum phase delay of thermal response to periodically modulated irradiation light. For comparisons, steady-state method with constant heat flux is also performed. The results of both methods show the similar tendency and the same order values.

Cite

CITATION STYLE

APA

KAGATA, K., YAMADA, T., & YOSHIDA, A. (2015). Photo-acoustic measurement and evaluation of thermal resistance of solid contact face. Transactions of the JSME (in Japanese), 81(823), 14-00435-14–00435. https://doi.org/10.1299/transjsme.14-00435

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free