Challenges and solutions to the defect-centric modeling and circuit simulation of time-dependent variability

2Citations
Citations of this article
3Readers
Mendeley users who have this article in their library.
Get full text

Abstract

Time-Dependent Variability (TDV) phenomena represent a serious concern for device and circuit reliability. To address the TDV impact at circuit level, Reliability-Aware Design (RAD) tools can be used by circuit designers to achieve more reliable circuits. However, this is not a straightforward task, since the development of RAD tools comprises several steps such as the characterization, modeling and simulation of TDV phenomena. Furthermore, in deeply-scaled CMOS technologies, TDV reveals a stochastic nature that can complicate those steps. In this invited paper, we review some of the main challenges that appear in each step of the flow towards the development of RAD tools, providing our solutions to them.

Cite

CITATION STYLE

APA

Martin-Martinez, J., Diaz-Fortuny, J., Saraza-Canflanca, P., Rodriguez, R., Castro-Lopez, R., Roca, E., … Nafria, M. (2023). Challenges and solutions to the defect-centric modeling and circuit simulation of time-dependent variability. In IEEE International Reliability Physics Symposium Proceedings (Vol. 2023-March). Institute of Electrical and Electronics Engineers Inc. https://doi.org/10.1109/IRPS48203.2023.10118334

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free